The use of smartphones and tablet PCs continues to grow globally. In addition, the functionality of these devices continues to increase, which has created the need for smaller and highly specialized PCBs. IC substrates are utilized as the connection between the IC chips and the PCB, and represent state-of-the-art miniaturization in PCB design. Often referred to as chip scale package, package-on-package, or multi-chip package solutions, these PCBs are
routinely found in smartphones and tablet PCs.